?2015 littelfuse, inc. specifcations are subject to change without notice. tvs diode arrays (spa ? diodes) revision: 02/24/16 lightning surge protection - slvu2.8-4btg-s description features applications the slvu2.8-4btg-s was designed to protect low voltage, cmos devices from esd and lightning induced transients. there is a compensating diode in series with each low voltage tvs to present a low loading capacitance to the line being protected. these robust structures can safely absorb repetitive esd strikes at 30kv (contact discharge) per iec61000-4-2 standard and each structure can safely dissipate up to 40a (iec61000-4-5 2 nd edition, t p =8/20s) with very low clamping voltages. pinout functional block diagram ? esd, iec61000-4-2, 30kv contact, 30kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5 2 nd edition, 40a (8/20s) ? low capacitance of 2pf per line ? low leakage current of 1a (max) at 2.8v ? soic-8 (jedec mo-012) pin confguration allows for simple fow-through layout ? halogen free, lead free and rohs compliant ? 10/100/1000 ethernet ? wan/lan equipment ? switching systems ? desktops, servers, and notebooks ? analog inputs ? base stations 56 78 43 21 pin 1. 3 pin 2.4 pin 6.8 pin 5.7 rohs pb green application example et hernet ph y j1 j8 rj -4 5 co nn ecto r slvu2.8-4 device is shown as transparent for actual footprint case gnd tx+ tx- rx+ rx- slvu2.8-4btg-s - 2.8v 40a tvs array
?2015 littelfuse, inc. specifcations are subject to change without notice. tvs diode arrays (spa ? diodes) revision: 02/24/16 lightning surge protection - slvu2.8-4btg-s absolute maximum ratings parameter rating units peak pulse power (t p =8/20s) 600 w peak pulse current (t p =8/20s) 40 a operating temperature -40 to 125 oc storage temperature -55 to 150 oc electrical characteristics (t op = 25c) parameter symbol test conditions min ty p max units reverse standoff voltage v rwm i r 1a 2.8 v reverse breakdown voltage v br i t =2a 3.0 v snap back voltage v sb i t =50ma 2.8 v reverse leakage current i leak v r =2.8v (each line) 1 a clamping voltage 1 v c i pp =5a, t p =8/20s (each line) 9.0 v clamping voltage 1 v c i pp =24a, t p =8/20s (each line) 18.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) 30 kv iec61000-4-2 (air) 30 kv dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) (each line) 1. 1 diode capacitance 1 c d v r =0v, f=1mhz (each line) 2.0 pf caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. note: 1 parameter is guaranteed by design and/or device characterization. clamping voltage vs. i pp capacitance vs. reverse voltage 8/20s pulse waveform 0 0. 5 1 1. 5 2 2. 5 3 3. 5 4 4. 5 5 00 .4 0. 81 .2 1. 62 2. 42 .8 capaci ta nce ( pf) bi as vo lt age (v ) 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp 0. 0 5. 0 10.0 15.0 20.0 0. 05 .0 10. 01 5. 02 0. 02 5. 0 cl am p vo lt age (v c ) peak pu ls e cu rren t- i pp (a )
?2015 littelfuse, inc. specifcations are subject to change without notice. tvs diode arrays (spa ? diodes) revision: 02/24/16 lightning surge protection - slvu2.8-4btg-s ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 5c/second max t s(max) to t l - ramp-up rate 5c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 5c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters package dimensions mechanical drawings and recommended solder pad outline package soic-8 pins 8 jedec ms-012 millimetres inches min max min max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 a2 1.25 1.65 0.050 0.065 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 d 4.80 5.00 0.189 0.197 e 5.80 6.20 0.228 0.244 e1 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc l 0.40 1.27 0.016 0.050 o recommended soldering pad outlin e (reference only) f l product characteristics lead plating matte tin lead material copper alloy lead coplanarity 0.004 inches(0.102mm) substrate material silicon body material molded epoxy flammability ul 94 v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-203 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13.
?2015 littelfuse, inc. specifcations are subject to change without notice. tvs diode arrays (spa ? diodes) revision: 02/24/16 lightning surge protection - slvu2.8-4btg-s ordering information part number package marking min. order qty. slvu2.8-4btg-s soic-8 u2.8-4 2500 part numbering system part marking system slvu2.8 b t g series package b = soic-8 no. of channels t= tape & reel -4 g= green - s customer code f l date code marking x:location yyww: date code u2.8-4 xyyww marking code pin 1 embossed carrier tape & reel speci?cation soic package user f eeding direc tion pin 1 l ocation symbol millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 5.4 5.6 0.213 0.22 p2 1.95 2.05 0.077 0.081 d 1. 5 1. 6 0.059 0.063 d1 1.50 min 0.059 min p0 3.9 4.1 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 11. 9 12.1 0.468 0.476 p 7. 9 8.1 0.311 0.319 a0 6.3 6.5 0.248 0.256 b0 5.1 5.3 0.2 0.209 k0 2 2.2 0.079 0.087 t 0.30 +/- 0.05 0.012 +/- 0.002
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